• Company
• About Us
• Process Capability - Technology Platforms
  • Diffusion/Deposition (6")
  • Diffusion, Thin Films & Implant
  • PECVD
  • Physical Vapour Deposition
  • PVD- Fab3
  • Implant (4" & 6" capability)
  • Dry Isotropic Etch
  • Wafer Bonding
  • Plasma Etch (6")
  • Photo Lithography
  • Metrology
  • Wet Chemical Etch
  • Deep Reactive Ion Etching (DRIE)
• Quality Assurance
• Who We Work With
• Board
• Business Team

Dry Isotropic Etch

• Residue Free, High Selectivity, Isotropic Etching
• Release and Sacrificial Etch steps for MEMS
• Materials include:
  • Polysilicon, Amorphous Silicon, Single Crystal Silicon
  • Resist, polymers

Applications include:

• Membranes, cantilevers, channels and bridges
• Processes include: Vapour XeF2, O2, CF4

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