• Company
• About Us
• Process Capability - Technology Platforms
  • Diffusion/Deposition (6")
  • Diffusion, Thin Films & Implant
  • PECVD
  • Physical Vapour Deposition
  • PVD- Fab3
  • Implant (4" & 6" capability)
  • Dry Isotropic Etch
  • Wafer Bonding
  • Plasma Etch (6")
  • Photo Lithography
  • Metrology
  • Wet Chemical Etch
  • Deep Reactive Ion Etching (DRIE)
• Quality Assurance
• Who We Work With
• Board
• Business Team

Plasma Etch (6")

• Oxide, Nitride, Polysilicon, Silicon, Oxynitride, Aluminium and TiW etch
• Plasma Resist removal
• Silicon, Nitride, Polysilicon, SiCr and TiW plasma etch (SF6, SF6/O2)
• Oxide and Oxynitride plasma etch (C2F6, CHF3)
• Aluminium plasma etch (BCl3, Cl2, CH4, N2, CF4, O2)
• Resist and Polyimide etch (O2, CF4)

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