• Company
• About Us
• Process Capability - Technology Platforms
  • Diffusion/Deposition (6")
  • Diffusion, Thin Films & Implant
  • PECVD
  • Physical Vapour Deposition
  • PVD- Fab3
  • Implant (4" & 6" capability)
  • Dry Isotropic Etch
  • Wafer Bonding
  • Plasma Etch (6")
  • Photo Lithography
  • Metrology
  • Wet Chemical Etch
  • Deep Reactive Ion Etching (DRIE)
• Quality Assurance
• Who We Work With
• Board
• Business Team

Wet Chemical Etch

Fabs 1, 2 & 3:

• RCA type Pre-Diffusion cleans (4" & 6")
• Oxide wet etch
• Nitride wet etch
• Aluminium, Silicon and TiW wet etches
• Pre & Post metal wet resist strip
• Phophorous & Boron Deglaze
• Hydrofluoric etch (oxide)
• Orthophosphorice etch (nitride)
• Sulphuric Peroxide mix (resist removal and wafer clean)
• Aluminium & Silicon etch chemical mixes
• Solvent resist stripping

Fab2 MEMS:

• Gold, NiCr and TiW chemical wet etches
• Potassium Hydroxide for deep Silicon wet etch (MEMS membrane release)
• Resist Lift Off processing (Acetone & NMP)

News