Accelerometer

A 3 axis accelerometer is currently under development.
This is a triple stack bonded structure with a die size of
3mm x 3mm.

The accelerometer structure integrates CMOS & MEMS technologies.
CMOS signal processing circuitry is embedded on the accelerometer's proof mass.

More information to follow…

This development is a collaboration between Semefab and iSLI. 

Contact Ian McNaught to discuss accelerometer applications.