Dry Isotropic Etch

• Residue Free, High Selectivity, Isotropic Etching
• Release and Sacrificial Etch steps for MEMS
• Materials include:
  • Polysilicon, Amorphous Silicon, Single Crystal Silicon
  • Resist, polymers
• Applications include:
  • Membranes, cantilevers, channels and bridges
• Processes include: Vapour XeF2, O2, CF4