Physical Vapour Deposition

• Sputtering of Aluminium, Aluminium/Silicon, Aluminium/Copper alloys for IC and MEMS interconnect
• Gold/Ti-Tungsten sputter for Bipolar/RF interconnect and wafer backmetals for eutectic die attach
• Sichrome, Nichrome for highly stable resistors
• Evaporation of Gold, Titanium, Nickel, Platinum, Aluminium, Tin and other pure metals for MEMS interconnect, under bump metallisation, solderable pads and wafer backmetals
• Additional 2 sputtering systems (6 chambers) available for specific sputtering requirements
  • Two chambers are presently populated with Constantan and Vanadium.
  • Two chambers have reactive sputter capable with an RF Sputter etch pre clean station.