Semefab Dry Isotopic Etch

Dry Isotropic Etch

Residue Free, High Selectivity, Isotropic Etching
Release and Sacrificial Etch steps for MEMS
Materials include:
- Polysilicon, Amorphous Silicon, Single Crystal Silicon
- Silicon Oxides and Nitrides
- Transition Metals, Mo, Ta, W, Ti
- Resist, polymers
Applications include:
- Membranes, cantilevers, channels and bridges
Processes include:
- Vapour HF, XeF2, O2, CF4

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