Semefab Physical Vapour Deposition PVD

Physical Vapour deposition (PVD)

Sputtering of Aluminium, Aluminium/Silicon, Aluminium/Copper alloys for IC and MEMS interconnect Gold/Ti-Tungsten sputter for Bipolar/RF interconnect and wafer backmetals for eutectic die attach Sichrome, Nichrome and other Cermet materials for highly stable resistors Evaporation of Gold, Titanium, Nickel, Platinum, Aluminium, Tin and other pure metals, for MEMS interconnect, under bump metallisation, solderable pads and wafer backmetals

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